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341746

Sigma-Aldrich

Copper(II) acetate hydrate

98%

Synonym(s):

Cupric acetate hydrate

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About This Item

Linear Formula:
Cu(CO2CH3)2 · xH2O
CAS Number:
66923-66-8
Molecular Weight:
181.63 (anhydrous basis)
EC Number:
205-553-3
MDL number:
MFCD00149570
UNSPSC Code:
12352103
PubChem Substance ID:
24860988
NACRES:
NA.23

Key Documents

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vapor density

6.9 (vs air)

Quality Level

100

assay

98%

form

crystals

composition

Degree of hydration, ~1

reaction suitability

core: copper

SMILES string

O.CC(=O)O[Cu]OC(C)=O

InChI

1S/2C2H4O2.Cu.H2O/c2*1-2(3)4;;/h2*1H3,(H,3,4);;1H2/q;;+2;/p-2

InChI key

NWFNSTOSIVLCJA-UHFFFAOYSA-L

Related Categories

General description

Copper(II) acetate hydrate is a high-purity (98%), blue crystalline solid widely used as a versatile precursor for copper-based materials. Its hydrate form enhances solubility in aqueous/organic solvents, facilitating solution processing for advanced applications. Recent research emphasizes its role in sustainable energy technologies, catalysis, and functional nanomaterials, aligning with trends in green chemistry and renewable energy.

Application

Copper(II) acetate hydrate can be used as:
  • A copper source in synthesizing CuS@C nanocomposites for sodium-ion battery anodes, delivering 485 mAh/g capacity after 200 cycles.
  • A precursor to synthesize copper oxide thin films through deposition techniques like atomic layer deposition (ALD) and pulsed spray pyrolysis, enabling p-type semiconductor layers for optoelectronic applications.
  • A electrocatalyst precursor for CO2 reduction to ethanol.
  • A Precursor for superhydrophobic coatings via electrochemical deposition.

pictograms

Exclamation markEnvironment
GHS07,GHS09

signalword

Warning

Hazard Classifications

Acute Tox. 4 Oral - Aquatic Acute 1 - Eye Irrit. 2 - Skin Irrit. 2 - STOT SE 3

target_organs

Respiratory system

Storage Class

11 - Combustible Solids

wgk_germany

WGK 3

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

dust mask type N95 (US), Eyeshields, Gloves

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Certificates of Analysis (COA)

Lot/Batch Number
MKCJ0700
MKBZ3289V
MKBB2350V
MKBB2350
06709JJ

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Anaisa A Leyva-Diaz et al.
Journal of animal science and biotechnology, 12(1), 23-23 (2021-02-06)
Interest in the use of natural feed additives as an alternative to antimicrobials in the poultry industry has increased in recent years because of the risk of bacterial resistance. One of the most studied groups are polyphenolic compounds, given their
Alexander Navarrete et al.
Faraday discussions, 183, 249-259 (2015-09-24)
A novel plasmonic reactor concept is proposed and tested to work as a visible energy harvesting device while allowing reactions to transform CO2 to be carried out. Particularly the reverse water gas shift (RWGS) reaction has been tested as a
Monica L Ohnsorg et al.
Langmuir : the ACS journal of surfaces and colloids, 31(22), 6114-6121 (2015-05-29)
Thin films can integrate the versatility and great potential found in the emerging field of metal-organic frameworks directly into device architectures. For fabrication of smart interfaces containing surface-anchored metal-organic frameworks, it is important to understand how the foundational layers form
Łukasz Orzeł et al.
Dalton transactions (Cambridge, England : 2003), 44(13), 6012-6022 (2015-02-28)
The nature of chlorophyll interactions with copper(II) ions varies considerably in organic solvents, depending on the dominant coordinative form. Besides formation of the metallo tetrapyrrolic complex, Cu(II) ions can cause oxidation of the pigment, reversible or irreversible, which can lead
Jannet Kamoun et al.
Biochimica et biophysica acta, 1851(2), 129-140 (2014-12-03)
Yarrowia lipolytica is a lipolytic yeast possessing 16 paralog genes coding for lipases. Little information on these lipases has been obtained and only the major secreted lipase, namely YLLIP2, had been biochemically and structurally characterized. Another secreted lipase, YLLIP8, was

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Group 11 Thin Films by Atomic Layer Deposition

Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.

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